Electronic Products & Technology

High elongation epoxy system boosts thermal shock resistance

Stephen Law   

Electronics Production / Materials Supply Chain epoxy epoxy shock shock system system thermal thermal

MASTER BOND EP110F8-3 two part epoxy system is suitable for sealing, encapsulating, potting, and casting applications. Toughened system improves flexibility and possesses a relatively high elongation of 120-150%. Product delivers a low tensile modulus of around 5,000-15,000psi and a shore A hardness of 40-50 at room temperature. Product boosts thermal cycling and shock resistance, passing 10 cycles from -55°C to +125°C with no signs of cracking. Product comes with an improved electrical insulation profile with a low dielectric constant of 2.67 as well as a low dissipation factor of 0.006, both measured at 75°F for 1 KHz.

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